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Description |
Standard PI film tape uses polyimide film as Backing, and the adhesive
layer is acrylic-based. Suitable for insulation protection in High
Temp environment.
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Structure |
Backing： PI film
Adhesive： Acrylic
Release Liner： Release paper or release film
Adhesion Range： > 800 g/25mm
Total Thickness(Without Release Liner)： 0.03 mm ~ 0.1mm (Custom)
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Features |
■ PI film Heat resistant is not easy to shrink, and can still maintain
dimensional stability in a High Temp environment.
■ PI film is a thin, high-strength insulating material and has good
solvent resistance and chemical stability.
■ N/A silicon residue |
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Usage |
■ Insulation Usage
■ Usage for grounding, winding and fixing parts such as transformers,
capacitors, coils and circuits
■ FPC (flexible printed circuit) coating |
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Jimei Industrial Park No. 18
Mr. Xiao: 185-596-77928