PI film tape
| Backing ： | PI film |
| Adhesive： | Acrylic |
| Release liner： | Release paper or release film |
| Description： |
Standard PI film tape uses PI film as Backing, and the
adhesive layer is Acrylic. Suitable for insulation protection in high temperature environments. |
| Adhesion： | > 800 g/25mm |
| Total Thickness (withoutRelease liner)： | 0.03 mm ~ 0.1mm (Custom) |
| Feature： |
■ PI film can withstand high temperatures up to 250℃, and
can maintain high dimensional stability in a high
temperature environment. It is not easy to close. ■ High-strength insulation material, good solvent resistance and chemical stability. ■ Combined with Acrylic, the adhesion can be adjusted ■ No silicon residue |
| Applications： |
■ Applications for winding and fixing, parts such as
transformers, capacitors, coils and circuits ■ FPC (flexible printed circuit) coating ■ Battery outer layer or edge wrapping ■ Insulation Applications |
| TY ： | TY PI701-P, TY PI702-P |
| Backing ： | PI film |
| Adhesive： | Silicone |
| Release liner： | PET film or Fluoroplastic film |
| Description： | Silicone-based PI film tape uses PI film as the backing, and the adhesive layer is Silicone. Excellent high temperature resistance, short-term resistance to 260°C, resistance to chemicals and solvents. |
| Adhesion： | > 400 g/25mm |
| Total Thickness (withoutRelease liner)： | 0.06 mm ~ 0.09mm (Custom) |
| Feature： |
■ PI film can withstand high temperature up to 280℃, it can
maintain high dimensional stability in high temperature
environment and it is not easy to close. ■ High-strength insulation material, good solvent resistance and chemical stability. ■ Combined with Silicone, can withstand high temperature 120℃～260℃ ■ The overall temperature resistance can reach 260℃ |
| Applications： |
■ Masking protection of the pure gold contact points on the
printed circuit board in the wave soldering or hot air
leveling process ■ Applications Insulation winding and fixing in high temperature environments, such as coils, generators, capacitors or transformers ■ During the dip soldering process, the cladding layer of FPC (flexible printed circuit) ■ Insulation Applications |
| TY ： | TY PIS701-F, TY PIS702-F |
| Backing ： | Black PI film |
| Adhesive： | Acrylic |
| Release liner： | Release paper or release film |
| Description： | The Backing of Matte black PI film tape is based on Black PI film, and the adhesive layer is Acrylic. It provides good UV and light masking. |
| Adhesion： | > 400 g/25mm |
| Total Thickness (withoutRelease liner)： | 0.03 mm ~ 0.11mm (Custom) |
| Feature： |
■ This series mainly lies in the design of the original
film, The printed layer has excellent insulation properties (surface resistance≧10^10Ω) Printed layer can resist fingerprints The printed layer is resistant to rubbing The printed layer is solvent-resistant cleaning (specified solvent) ■ BlackApplications Yuguang Maskingor prevents light leakage, the thickness of the original Black film is as thin as 20um ■ The printing layer can be CCustomized design |
| Applications： |
■ High adhesion film electronic insulation tape is needed in
a narrow space ■ Applications are wrapped around the label or edge of the battery outer layer |
| TY ： |
TY PIT701-B, TY PIT702-B TY PI2050-B, TY PI701-50B-A2 |
| Backing ： | PI film |
| Adhesive： | Anti-static ESDAcrylic |
| Release liner： | Release paper or release film or Anti-static ESDRelease film |
| Description： | Anti-static ESD PI film tape uses Anti-static ESDPI film as Backing, and the adhesive layer is Anti-static ESD adhesive |
| Adhesion： | > 800 g/25mm |
| Total Thickness (withoutRelease liner)： | 0.03 mm ~ 0.1mm (Custom) |
| Feature： |
■ Anti-static ESD protective film can effectively reduce the
static electricity and voltage generated during bonding and
peeling, prevent dust adsorption and avoid abnormal
appearance or performance caused by dirt ■ Anti-static ESDRelease film for the substrate, which can more effectively reduce the static electricity and voltage generated during the bonding and peeling ■ Surface resistance can reach 10^11 ~ 10^12Ω ■ Substrate Anti-static ESDRelease film ■ PI film can still maintain dimensional stability in a high temperature environment |
| Applications： |
■ Applications for winding and fixing, parts such as
transformers, capacitors, coils and circuits ■ FPC (flexible printed circuit) coating ■ Battery outer layer or edge wrapping ■ Insulation Applications |
| TY ： |
| Backing ： | PI film |
| Adhesive： | Flame retardant adhesive |
| Release liner： | Release paper or release film |
| Description： | Flame retardant PI film tape uses PI film as Backing, and the adhesive layer is Flame retardant Acrylic |
| Adhesion： | |
| Total Thickness (withoutRelease liner)： | |
| Feature： |
■ All environmental protection without halogen ■ Passed UL94 certification, Flame retardant grade reaches VTM-0 ■ PI film can still maintain dimensional stability in a high temperature environment ■ Adhesive has good initial adhesion |
| Applications： | ■In high temperature environment, insulation and protection of coils, generators, capacitors, or transformers |
| TY ： | PIF2050-B |
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